Summary
Tessolve is hiring 4 IC Packaging Design Engineers based in Chandler, AZ (primary) or Hillsboro, OR (secondary). We're looking for senior-level talent (10+ years) primarily, with mid-level (4–6+ years MS / 6+ years BS) candidates also considered.
About the Role
As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.
What You'll Do
What You Bring
What We Offer
About us:
Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth.
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